6+1+1 Phases Hybrid Power Design
Cleaner and more efficient power delivery to the CPU with better thermal performance ensure stability under high CPU frequencies and heavy loading.
PCIe 4.0 Design
GIGABYTE Q670 Motherboards are ready to work with the PCIe 4.0 devices which are expected to experience twice bandwidth than the current PCIe 3.0 devices. To reach the high speed and maintain good signal integrity, GIGABYTE R&D uses the low impedance PCB to provide the maximum performance.
Hybrid Cores Optimization
With new Intel Hybrid technology, GIGABYTE exclusively creates two new " CPU Upgrade " in BIOS profiles to meet different users’ scenarios by adjusting P-Core and E-Core activation and voltage policy.
Support for DDR5 XMP Up to 5600MHz and Beyond
AORUS is offering a tested and proven platform that ensures proper compatibility with profiles up to 5600MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard.
Shielded Memory Routing
All memory routing is under the PCB inner layer shielded by a large ground layer to protect from external interference.
GIGABYTE Ultra-Efficient M.2 Thermal Guard
With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.
Smart Fan 6
Smart Fan 6 contains several unique cooling features that ensure gaming PC maintain its performance while staying cool and quiet. Multiple fan headers can support PWM/DC fan and pump, and users can easily define each fan curve based on different temperature sensors across the board via intuitive user interface.
Dual Intel® GbE LAN with Bandwidth Management
Dual Intel® GbE LAN features with network traffic management application which helps to improve network latency and maintain low ping times to deliver better responsiveness in crowded LAN environments.
The World's Next Universal Connector
The USB Type-C® is a new reversible connector that is loaded with useful features such as USB 3.2 Gen 2 support for 10Gb/s transfer speed. Powered by the Intel® USB 3.2 Gen 2 controller, this little port provides the best USB Type-C® experience possible.
HDMI 2.0 for 4K UHD Display and HDCP 2.2 supported
HDMI 2.0, which is backwards compatible with HDMI 1.4, offers 18 Gb/s of bandwidth – nearly twice that of the previous generation. This unlocks the potential for users to transfer multiple video streams, as well as a native cinematic 21:9 ratio (which most movies are shot in), offering the best visual experience for viewers.
High-End Audio Capacitors
GIGABYTE motherboards use high-end audio capacitors. These high quality capacitors help deliver high resolution and high fidelity audio to provide the most realistic sound effects for gamers.
Audio Noise Guard
GIGABYTE motherboards feature an audio noise guard that essentially separates the board’s sensitive analog audio components from potential noise pollution at the PCB level.
Solid Pin Power Connectors
Q670 motherboards feature solid plated ATX 12V 8pin power connectors to offer a stable power supply during CPU overloading.
Main Features
- Supports Intel Core 14th/ 13th /12th processors
- Dual Channel Non-ECC Unbuffered DDR5, 4 DIMMs
- 6+1+1 Phases Hybrid Digital VRM with MOS Heatsink
- Dual GbE LAN with Bandwidth Management
- Dual Ultra-Fast NVMe PCIe 4.0 x4 M.2 with One Thermal Guard
- Rear USB 3.2 Gen 2 Type-C for Fast and Versatile Connections
- High Quality Audio Capacitors and Audio Noise Guard
- Smart Fan 6 Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
- Support Intel vPro Technology